67SLG040035030PI00

67SLG040035030PI00

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Manufacturer Part 67SLG040035030PI00
Manufacturer Laird - Performance Materials
Description METAL FILM OVER FOAM CONTACTS
Category RF/IF and RFID
Family RFI and EMI - Contacts, Fingerstock and Gaskets
Lifecycle: New from this manufacturer.
Delivery: DHL FedEx Ups TNT EMS
Payment T/T Paypal Visa MoneyGram Western Union
DataSheet 67SLG040035030PI00 PDF

Availability

InStock 5,065
UnitPrice $ 1.19000

67SLG040035030PI00 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team rfq@www.zhschip.com

67SLG040035030PI00 Specifications

Type Description
Series:SMD Grounding Metallized
Package:Tape & Reel (TR)Cut Tape (CT)
Part Status:Active
Type:Film Over Foam
Shape:Rectangle
Width:0.157" (4.00mm)
Length:0.118" (3.00mm)
Height:0.138" (3.50mm)
Material:Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating:-
Plating - Thickness:-
Attachment Method:Solder
Operating Temperature:-40°C ~ 70°C

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

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