BSM180D12P3C007

BSM180D12P3C007

Irudia erreferentziarako da, mesedez jarri gurekin harremanetan benetako argazkia lortzeko

Fabrikatzailearen zatia BSM180D12P3C007
Fabrikatzailea ROHM Semiconductor
Deskribapena SIC POWER MODULE
Kategoria produktu erdieroale diskretuak
Familia transistoreak - fets, mosfets - array
Bizitzaren zikloa: New from this manufacturer.
Entrega: DHL FedEx Ups TNT EMS
Ordainketa T/T Paypal Visa MoneyGram Western Union
Datu-fitxa BSM180D12P3C007 PDF

Eskuragarritasuna

InStock 11
Unitatearen Prezioa $ 563.26000

BSM180D12P3C007 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team rfq@www.zhschip.com

BSM180D12P3C007 Zehaztapenak

Mota Deskribapena
seriea:-
paketea:Bulk
zatiaren egoera:Active
fet mota:2 N-Channel (Dual)
fet ezaugarri:Silicon Carbide (SiC)
draina iturriko tentsioa (vdss):1200V (1.2kV)
korrontea - drainatze jarraitua (id) @ 25 °c:180A (Tc)
rds on (gehienez) @ id, vgs:-
vgs (th) (gehienez) @ id:5.6V @ 50mA
atearen karga (qg) (gehienez) @ vgs:-
sarrerako kapazitatea (ciss) (max) @ vds:900pF @ 10V
potentzia - max:880W
funtzionamendu-tenperatura:175°C (TJ)
muntaketa mota:Surface Mount
pakete / kaxa:Module
hornitzaileen gailu paketea:Module

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

Produktu aipagarriak

Copyright © 2024 ZHONG HAI SHENG TECHNOLOGY LIMITED All Rights Reserved.

Pribatutasun-adierazpena | Erabilera baldintzak | Kalitate Bermea

Top